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标题: 集成电路标准封装(a-f开关头) [打印本页]

作者: 45676765dd 时间: 2011-3-11 09:54
标题: 集成电路标准封装(a-f开关头)
外形图封装说明

AC'97v2.2 specifICation

AGP 3.3VACCelerated Graphics PortSpecification 2.0

AGP PROAccelerated Graphics Port PROSpecification 1.01

AGPAccelerated Graphics PortSpecification 2.0

AMRAudio/Modem Riser

BGABall Grid Array

BQFP132

EBGA 680L

LBGA 160L

PBGA 217LPlastic Ball Grid Array

SBGA 192L

TSBGA 680L

C-Bend Lead

CerquadCeramic Quad Flat PACk

CLCC

CNRCommunication and Networking Riser Specification Revision 1.2

CPGACeramic PIN Grid Array

Ceramic Case

LAMINATE CSP 112LChip Scale Package

DIPDual Inline Package

DIP-tabDual Inline Package with Metal Heatsink

DIMM 168

DIMM DDR

DIMM168Dual In-line Memory Module

DIMM184For DDR SDRAM Dual In-line Memory Module

EISAExtended ISA

FBGA

FDIP

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