集成电路标准封装(a-f开关头)

45676765dd

外形图封装说明AC'97v2.2 specifICation AGP 3.3VACCelerated Graphics PortSpecification 2.0AGP PROAccelerated Graphics Port PROSpecification 1.01AGPAccelerated Graphics PortSpecification 2.0AMRAudio/Modem RiserBGABall Grid ArrayBQFP132EBGA 680L LBGA 160L PBGA 217LPlastic Ball Grid ArraySBGA 192L TSBGA 680L C-Bend Lead CerquadCeramic Quad Flat PACkCLCC CNRCommunication and Networking Riser Specification Revision 1.2CPGACeramic PIN Grid ArrayCeramic CaseLAMINATE CSP 112LChip Scale PackageDIPDual Inline PackageDIP-tabDual Inline Package with Metal HeatsinkDIMM 168 DIMM DDR DIMM168Dual In-line Memory ModuleDIMM184For DDR SDRAM Dual In-line Memory ModuleEISAExtended ISAFBGAFDIP