集成电路标准封装(p-z开关头)
外形图封装说明http://www.go-gddq.com//upload/2006_06/060621185340651.jpgTQFP 100L 详细规格http://www.go-gddq.com//upload/2006_06/060621185340654.gifTSOPThin Small Outline PACkagehttp://www.go-gddq.com//upload/2006_06/060621185340658.jpgTSSOP or TSOP IIThin Shrink Outline Packagehttp://www.go-gddq.com//upload/2006_06/060621185340657.jpgLAMINATE TCSP 20LChip Scale Package详细规格http://www.go-gddq.com//upload/2006_06/060621185340652.jpgLAMINATE UCSP 32LChip Scale Package详细规格http://www.go-gddq.com//upload/2006_06/060621185340656.gifuBGAMICro Ball Grid Arrayhttp://www.go-gddq.com//upload/2006_06/0606211853406510.gifuBGAMicro Ball Grid Arrayhttp://www.go-gddq.com//upload/2006_06/060621185340653.jpgVL BusVESA LOCal Bushttp://www.go-gddq.com//upload/2006_06/060621185340659.jpgXT Bus8bithttp://www.go-gddq.com//upload/2006_06/060621185340655.gifZIPZig-Zag Inline Package
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